Parlak, M. Et Al. 2023. Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II. 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023 , (Florida, United States Of America).

Parlak, M., Sen, A. S., & Yagci, V., (2023). Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II . 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023, Florida, United States Of America

Parlak, Murat, Ahmet Sahin Sen, And Vedat Yagci. "Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II," 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023, Florida, United States Of America, 2023

Parlak, Murat Et Al. "Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II." 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023 , Florida, United States Of America, 2023

Parlak, M. Sen, A. S. And Yagci, V. (2023) . "Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II." 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023 , Florida, United States Of America.

@conferencepaper{conferencepaper, author={Murat Parlak Et Al. }, title={Novel Thermal Packaging Approach for an Airtight Electronic Chassis without Card Retainer-II}, congress name={22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023}, city={Florida}, country={United States Of America}, year={2023}}