Boyuk, U. And Marasli, N. 2010. Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder. MATERIALS CHEMISTRY AND PHYSICS , vol.119, no.3 , 442-448.

Boyuk, U., & Marasli, N., (2010). Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder. MATERIALS CHEMISTRY AND PHYSICS , vol.119, no.3, 442-448.

Boyuk, U., And Necmettin MARAŞLI. "Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder," MATERIALS CHEMISTRY AND PHYSICS , vol.119, no.3, 442-448, 2010

Boyuk, U. And Marasli, Necmettin. "Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder." MATERIALS CHEMISTRY AND PHYSICS , vol.119, no.3, pp.442-448, 2010

Boyuk, U. And Marasli, N. (2010) . "Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder." MATERIALS CHEMISTRY AND PHYSICS , vol.119, no.3, pp.442-448.

@article{article, author={U. Boyuk And author={Necmettin MARAŞLI}, title={Dependency of eutectic spacings and microhardness on the temperature gradient for directionally solidified Sn-Ag-Cu lead-free solder}, journal={MATERIALS CHEMISTRY AND PHYSICS}, year=2010, pages={442-448} }