Atıf Formatları
The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy
  • IEEE
  • ACM
  • APA
  • Chicago
  • MLA
  • Harvard
  • BibTeX

U. Boyuk And N. Marasli, "The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy," JOURNAL OF ALLOYS AND COMPOUNDS , vol.485, pp.264-269, 2009

Boyuk, U. And Marasli, N. 2009. The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy. JOURNAL OF ALLOYS AND COMPOUNDS , vol.485 , 264-269.

Boyuk, U., & Marasli, N., (2009). The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy. JOURNAL OF ALLOYS AND COMPOUNDS , vol.485, 264-269.

Boyuk, U., And Necmettin MARAŞLI. "The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy," JOURNAL OF ALLOYS AND COMPOUNDS , vol.485, 264-269, 2009

Boyuk, U. And Marasli, Necmettin. "The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy." JOURNAL OF ALLOYS AND COMPOUNDS , vol.485, pp.264-269, 2009

Boyuk, U. And Marasli, N. (2009) . "The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy." JOURNAL OF ALLOYS AND COMPOUNDS , vol.485, pp.264-269.

@article{article, author={U. Boyuk And author={Necmettin MARAŞLI}, title={The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy}, journal={JOURNAL OF ALLOYS AND COMPOUNDS}, year=2009, pages={264-269} }