Atıf Formatları
Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi
  • IEEE
  • ACM
  • APA
  • Chicago
  • MLA
  • Harvard
  • BibTeX

N. Sarigul And T. YILDIRIM, "Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi," 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022 , Antalya, Turkey, 2022

Sarigul, N. And YILDIRIM, T. 2022. Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi. 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022 , (Antalya, Turkey).

Sarigul, N., & YILDIRIM, T., (2022). Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi . 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022, Antalya, Turkey

Sarigul, Neslihan, And Tülay YILDIRIM. "Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi," 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022, Antalya, Turkey, 2022

Sarigul, Neslihan And YILDIRIM, Tülay. "Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi." 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022 , Antalya, Turkey, 2022

Sarigul, N. And YILDIRIM, T. (2022) . "Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi." 2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022 , Antalya, Turkey.

@conferencepaper{conferencepaper, author={Neslihan Sarigul And author={Tülay YILDIRIM}, title={Classification of Solder Quality in Through-Hole Devices by Convolutional Neural Networks Evrisimsel Sinir Aglari ile Through-Hole Cihazlarda Lehim Kalitesinin Siniflandirilmasi}, congress name={2022 Innovations in Intelligent Systems and Applications Conference, ASYU 2022}, city={Antalya}, country={Turkey}, year={2022}}