Boyuk, U. And Maraşlı, N. 2009. The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder. TPS- 26 International Physics Conference , (Muğla, Turkey), 75.

Boyuk, U., & Maraşlı, N., (2009). The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder . TPS- 26 International Physics Conference (pp.75). Muğla, Turkey

Boyuk, U, And Necmettin MARAŞLI. "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder," TPS- 26 International Physics Conference, Muğla, Turkey, 2009

Boyuk, U And Maraşlı, Necmettin. "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder." TPS- 26 International Physics Conference , Muğla, Turkey, pp.75, 2009

Boyuk, U. And Maraşlı, N. (2009) . "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder." TPS- 26 International Physics Conference , Muğla, Turkey, p.75.

@conferencepaper{conferencepaper, author={U Boyuk And author={Necmettin MARAŞLI}, title={The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder}, congress name={TPS- 26 International Physics Conference}, city={Muğla}, country={Turkey}, year={2009}, pages={75} }