KAYA, H. Et Al. 2008. Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy. TPS-25 International Physics Conference , (Muğla, Turkey), 472.

KAYA, H., BOYUK, U., ENGIN, S., CADIRLI, E., & MARAŞLI, N., (2008). Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy . TPS-25 International Physics Conference (pp.472). Muğla, Turkey

KAYA, H Et Al. "Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy," TPS-25 International Physics Conference, Muğla, Turkey, 2008

KAYA, H Et Al. "Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy." TPS-25 International Physics Conference , Muğla, Turkey, pp.472, 2008

KAYA, H. Et Al. (2008) . "Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy." TPS-25 International Physics Conference , Muğla, Turkey, p.472.

@conferencepaper{conferencepaper, author={H KAYA Et Al. }, title={Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy}, congress name={TPS-25 International Physics Conference}, city={Muğla}, country={Turkey}, year={2008}, pages={472} }