Sengez, B. Et Al. 2013. Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly. MICROELECTRONIC ENGINEERING , vol.103 , 111-117.

Sengez, B., Dogruyol, Z., San, S. E., Kosemen, A., Yilmaz, F., Okutan, M., ... Yerli, Y.(2013). Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly. MICROELECTRONIC ENGINEERING , vol.103, 111-117.

Sengez, Busra Et Al. "Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly," MICROELECTRONIC ENGINEERING , vol.103, 111-117, 2013

Sengez, Busra Et Al. "Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly." MICROELECTRONIC ENGINEERING , vol.103, pp.111-117, 2013

Sengez, B. Et Al. (2013) . "Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly." MICROELECTRONIC ENGINEERING , vol.103, pp.111-117.

@article{article, author={Busra Sengez Et Al. }, title={Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly}, journal={MICROELECTRONIC ENGINEERING}, year=2013, pages={111-117} }