A series of thin Pt-Co films with different metal ratios were deposited by using the sequential cosputtering directly on a commercial hydrophobic carbon paper substrate at room temperature and in ultra-high vacuum (UHV) conditions. Their electrocatalytic properties toward the oxygen reduction reaction were investigated in 0.5 M H2SO4 solution by means of cyclic voltammetry (CV) and linear sweep voltammetry (ISV) on rotating disc electrode (RDE). The results showed that Pt particles, deposited by dc-magnetron gun, surround the large Co-clusters deposited by rf-magnetron gun. In addition, the increase of Co content led to an increase in the electrochemical active surface area (EASA) from 23.75 m(2)/gPt to 47.54 m(2)/gPt for pure Pt and Pt:Co (1:3), respectively, which corresponded the improvement of the utilization of Pt by a factor of 1.91. This improvement indicated that the sequential magnetron cosputtering was one of the essential technique to deposit homogeneous metal clusters with desirable size on the gas diffusion layer by adjustment plasma parameters.