Effect of solidification parameters on the microstructure of Sn-3.7Ag-0.9Zn solder

Boyuk U., Engin S., KAYA H., Marasli N.

MATERIALS CHARACTERIZATION, vol.61, no.11, pp.1260-1267, 2010 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 61 Issue: 11
  • Publication Date: 2010
  • Doi Number: 10.1016/j.matchar.2010.08.007
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1260-1267
  • Yıldız Technical University Affiliated: No


In this work Sn-Ag-Zn alloy of eutectic composition (Sn 3 7wt %Ag 0 9wt %Zn) was directionally solidified upward at a constant temperature gradient (G=4 33 K/mm) in a wide range of growth rates (V=3 38-22012 mu m/s) and a constant growth rate (V=11 52 mu m/s) with different temperature gradients (G=4 33-12 41 K/mm) using a Bridgman type directional solidification furnace The microstructure was observed to be a rod Ag(3)Sn structure in the matrix of beta-Sn from the directionally solidified Sn 3 7wt %Ag 0 9wt %Zn samples The values of eutectic spacing (A) were measured from transverse section of samples The dependency of eutectic spacing on the growth rate (V) and temperature gradient (G) were determined with linear regression analysis The dependency of lambda on the values of V and G were found to be lambda=10 42V(-0 53) and lambda=0 27G(-0 48) respectively The values of bulk growth were also determined to be lambda(2)V=86 39 mu m(3)/s by using the measured values of lambda and V The results obtained in present work were compared with the previous similar experimental results obtained for binary and ternary alloys (C) 2010 Published by Elsevier Inc