Investigations of Electrical Resistivity and Thermal Conductivity Dependences on Growth Rate in the Al-Cu-Ti Eutectic Alloy

MARAŞLI N., BAYRAM Ü.

INTERNATIONAL JOURNAL OF THERMOPHYSICS, vol.42, no.6, 2021 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 42 Issue: 6
  • Publication Date: 2021
  • Doi Number: 10.1007/s10765-021-02845-6
  • Journal Name: INTERNATIONAL JOURNAL OF THERMOPHYSICS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, DIALNET, Civil Engineering Abstracts
  • Yıldız Technical University Affiliated: Yes

Abstract

Directional solidification of Al-Cu-Ti (Al-33wt%Cu-0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 mu m.s(-1)) at a temperature gradient of 6.45 K.mm(-1) using Bridgman-type directional solidification furnace. The measurements of thermal conductivity (K) and electrical resistivity (rho) for the Al-Cu-Ti alloy solidified with the different values of V were made by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT). While the highest values of K and rho were determined to be 236.04 W.K-1.m(-1) and 5.91 x 10(-8) omega m, respectively, at 8.58 mu m.s(-1), the lowest values of K and rho were obtained to be 199.82 W.K-1.m(-1) and 12.11 x 10(-8) omega m, respectively, at 2038.65 mu m.s(-1). The K and rho dependences on V were obtained to be K=259.96xV(-0.032) and rho=4.47x10(-8)V(0.13) from linear regression analysis. The fusion enthalpy ( increment H) and specific heat difference between solid and liquid ( increment C-P) for the Al-Cu-Ti were also determined to be 222.69 J.g(-1) and 0.266 Jg(-1).K-1, respectively, by means of differential scanning calorimetry (DSC).