Experimental determination of thermal conductivity and solid-liquid interfacial energy of solid Ag3Sn intermetallic in the Sn-Ag-In ternary alloy

Ocak Y., Aksoz S., Marasli N., Keslioglu K.

INTERMETALLICS, cilt.18, sa.11, ss.2250-2258, 2010 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 18 Sayı: 11
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1016/j.intermet.2010.07.019
  • Dergi Adı: INTERMETALLICS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.2250-2258
  • Yıldız Teknik Üniversitesi Adresli: Hayır

Özet

The equilibrated grain boundary groove shapes of a solid Ag3Sn in equilibrium with a Sn-Ag-In eutectic liquid have been observed from a quenched sample with a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Ag3Sn have been determined from the observed grain boundary groove shapes The variation of thermal conductivity with temperature for solid Ag3Sn has been measured up to 5 K below the melting temperature with a radial heat flow apparatus The ratio of thermal conductivity of equilibrated Sn-Ag-In eutectic liquid to solid Ag3Sn has also been measured with a Bridgman-type growth apparatus at the melting temperature. (C) 2010 Elsevier Ltd. All rights reserved.