Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions


Creative Commons License

Arıbuğa D., Akkaşoğlu U., ÇİÇEK B. , Balcı-Çağıran Ö.

Materials, vol.15, no.5, 2022 (Journal Indexed in SCI) identifier identifier identifier

  • Publication Type: Article / Article
  • Volume: 15 Issue: 5
  • Publication Date: 2022
  • Doi Number: 10.3390/ma15051685
  • Title of Journal : Materials
  • Keywords: glass-BN composites, PVA addition, low temperature sintering, microstructure, thermal conductivity, dielectric constant, LTCC, TEMPERATURE COFIRED CERAMICS, CRYSTALLIZATION KINETICS, LTCC, FABRICATION, COMPOSITES, DESIGN, PHASE, B2O3

Abstract

© 2022 by the authors. Licensee MDPI, Basel, Switzerland.With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770◦ C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.