Recent Advances in Adhesively Bonded Lap Joints Having Bi-Adhesive and Modulus-Graded Bondlines: A Critical Review

ÖZ Ö., ÖZER H.

REVIEWS OF ADHESION AND ADHESIVES, cilt.6, sa.1, ss.82-103, 2018 (ESCI) identifier identifier

  • Yayın Türü: Makale / Derleme
  • Cilt numarası: 6 Sayı: 1
  • Basım Tarihi: 2018
  • Doi Numarası: 10.7569/raa.2018.097302
  • Dergi Adı: REVIEWS OF ADHESION AND ADHESIVES
  • Derginin Tarandığı İndeksler: Emerging Sources Citation Index (ESCI), Scopus
  • Sayfa Sayıları: ss.82-103
  • Yıldız Teknik Üniversitesi Adresli: Evet

Özet

Adhesives have become a key research area because of their potential applications. Two important issues facing designers in designing the bonded joints are reducing the stress concentration and increasing the failure load. An important remedy is to use bi-adhesive and modulus-graded adhesive joints. Here, we provide a critical review of recent developments in the field of bi-adhesive and modulus-graded adhesive joints.