Investigation of Stress and Delamination Behaviors of a Bonded Beam having Orthotropic Inclusion in Adhesive Layer under Tensile Loading
13th International Conference on Engineering and Innovative Materials, ICEIM 2024 and 6th International Conference on Advances in Materials, Mechanical and Manufacturing, AMMM 2024, Tokyo, Japonya, 6 - 08 Eylül 2024, cilt.169 AST, ss.85-90, (Tam Metin Bildiri)
- Yayın Türü: Bildiri / Tam Metin Bildiri
- Cilt numarası: 169 AST
- Doi Numarası: 10.4028/p-bs5fom
- Basıldığı Şehir: Tokyo
- Basıldığı Ülke: Japonya
- Sayfa Sayıları: ss.85-90
- Anahtar Kelimeler: Adhesive joints, delamination, finite element analysis, orthotropic inclusion
- Yıldız Teknik Üniversitesi Adresli: Evet
Özet
In this paper, the stress behaviors of the single lap joint having orthotropic inclusion in the adhesive layer under tensile load were analyzed. In these analyses, a more realistic approach was taken by considering the heterogeneous nature of the adhesive layer. In the study, there are three different orthotropic inclusion materials in the adhesive layers of the connections: glass-epoxy, graphite-epoxy and boron-epoxy. The effects of the selected inclusion material on the stresses in the connections were analyzed using the finite element method. When single lap connections are examined in terms of material, the stresses have the highest value for boron-epoxy inclusion and the lowest value for glass-epoxy inclusion Additionally, the effect of both the adherend material and the thickness of the inclusion material on the stresses was examined. According to this, in single lap connections, the highest peeling, shear and von-Mises stress values were observed on the adhesive layer when the to/ti value was 0.5. The possibility of delamination near the inclusion area has been taken into account.