Copper etching with cupric chloride and regeneration of waste etchant

ÇAKIR O.

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, cilt.175, ss.63-68, 2006 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 175
  • Basım Tarihi: 2006
  • Doi Numarası: 10.1016/j.jmatprotec.2005.04.024
  • Dergi Adı: JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.63-68
  • Anahtar Kelimeler: copper etching, cupric chloride, etch rate, waste regeneration
  • Yıldız Teknik Üniversitesi Adresli: Hayır

Özet

Copper etching is considerably important process in electronics industry. particularly in the fabrication of printed circuit board. Various etchants can be used for this purpose, but nowadays cupric chloride is more accepted etchant, because of its high etch rate and easy regeneration properties. In the present study, copper etching process with cupric chloride etchant was investigated. In the etching of copper, the most important etching parameter is etch rate, therefore the investigation was based on the various effects on etch rate. The influence of etchant concentration, additives and etching temperature were examined. It is also important to regeneration/recycle of waste etchant from environmental point of view. Thus, various cupric chloride etchant regeneration processes were investigated. (c) 2005 Elsevier B.V. All rights reserved.