Electro growth of Al[sbnd]Cu eutectic alloy

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BASİT S., Birinci S., MARAŞLI N.

Materials Characterization, vol.161, 2020 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 161
  • Publication Date: 2020
  • Doi Number: 10.1016/j.matchar.2020.110157
  • Journal Name: Materials Characterization
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Yıldız Technical University Affiliated: Yes

Abstract

The effects of directions and magnitudes of static electrical field on solidification of Ale33 wt.%Cu eutectic alloy

were investigated. For this purpose, a new directional solidification apparatus was specially designed to solidify

the AleCu eutectic alloy under static high electrical field (E). For the first time, the AleCu molten eutectic alloy

was solidified under different directions; parallel and antiparallel of the solid liquid interface growth direction

(E+ and E−, respectively) and magnitudes (7–10 kV/cm) of static high electrical fields. The lamellar spacing (λ),

eutectic grain size (EGS) and hardness (HB) of the AleCu eutectic alloy solidified with different values of E+ and

E− were measured with standards methods. It was observed that the static electrical field is an effective control

parameter on the directional solidification and the values of λ, EGS and HB are increased and decreased with

increasing the values of E+ and E−, respectively in the AleCu eutectic alloy. Finally, the dependency of λ, EGS

and HB values on E+ and E− values were obtained with linear regression analysis in the AleCu eutectic alloy.