Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy


Kaygisiz Y., Ocak Y., Aksoz S., Marasli N. , Keslioglu K., CADIRLI E., ...More

CHEMICAL PHYSICS LETTERS, vol.484, pp.219-224, 2010 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 484
  • Publication Date: 2010
  • Doi Number: 10.1016/j.cplett.2009.11.043
  • Title of Journal : CHEMICAL PHYSICS LETTERS
  • Page Numbers: pp.219-224

Abstract

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn have been determined to be (8.7 +/- 0.6) x 10(-8) Km, (113.1 +/- 13.6) x 10(-3) J m(-2) and (222.4 +/- 28.9) x 10(-3) J m(-2), respectively. The thermal conductivity of solid phase and the thermal conductivity ratio of liquid phase to solid phase for Sn-1.3 at.%Cu alloy have also been measured with radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2009 Elsevier B. V. All rights reserved.