The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder


Boyuk U., Maraşlı N.

TPS- 26 International Physics Conference, Muğla, Turkey, 24 September 2009, pp.75

  • Publication Type: Conference Paper / Summary Text
  • City: Muğla
  • Country: Turkey
  • Page Numbers: pp.75