The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder
Copy For Citation
Boyuk U., Maraşlı N.
TPS- 26 International Physics Conference, Muğla, Turkey, 24 September 2009, pp.75
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Publication Type:
Conference Paper / Summary Text
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City:
Muğla
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Country:
Turkey
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Page Numbers:
pp.75
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Yıldız Technical University Affiliated:
No