The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder
TPS- 26 International Physics Conference, Muğla, Turkey, 24 September 2009, pp.75, (Summary Text)
- Publication Type: Conference Paper / Summary Text
- City: Muğla
- Country: Turkey
- Page Numbers: pp.75
- Yıldız Technical University Affiliated: No