Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy | AVESİS

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Effect of the Temperature Gradient, Growth Rate and the Eutectic Spacing on the Microhardness in the Directionally Solidified Sn-Cu Eutectic Alloy

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KAYA H., BOYUK U., ENGIN S., CADIRLI E., MARAŞLI N.

TPS-25 International Physics Conference, Muğla, Turkey, 25 September 2008, pp.472

Publication Type: Conference Paper / Summary Text
City: Muğla
Country: Turkey
Page Numbers: pp.472
Yıldız Technical University Affiliated: No